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在众多影响UV-LIGA(Ultra-violet lithography Galvanik abformung)技术制备微细金属零件尺寸精度的因素中,SU-8胶溶胀性是最主要的。通常采用隔离带方法降低SU-8胶的溶胀性,以提高电铸微细零件的尺寸精度。由于贵重金属会沉积到隔离带内,造成了贵重金属的浪费,增加制造成本,因此该方法不适合贵重金属微细零件制造。针对隔离带方法的弊端,提出了半隔离带方法,在保证电铸微细金属零件尺寸精度的前提下,避免了贵重金属的浪费。另外,还采用电解液喷射方法实现了高电流密度电铸,缩短了电铸时间,进一步提高了电铸微细金属零件的尺寸精度。试验结果表明:采用半隔离带方法和高电流密度,可以有效提高金微细零件的尺寸精度,当电流密度提高到0.6A/dm2,金微细零件的尺寸精度可以达到5μm。
Among the many factors that affect the dimensional accuracy of the fine metal parts produced by UV-LIGA (Ultra-violet lithography Galvanik abformung) technology, SU-8 gel swelling is the most important. Isolation belt method is usually used to reduce the swelling of SU-8 plastic, in order to improve the dimensional accuracy of the electroformed parts. Since precious metals can be deposited in the barrier tape, resulting in the waste of valuable metals and increasing manufacturing costs, the method is not suitable for the manufacture of precious metal parts. Aiming at the drawbacks of the isolation tape method, a semi-isolation tape method is proposed, which avoids the waste of precious metals under the premise of ensuring the dimensional accuracy of the electroformed metal parts. In addition, the use of electrolyte injection method to achieve a high current density electroforming, shortening the electroforming time and further improve the dimensional accuracy of electroformed metal parts. The test results show that the semi-insulating tape method and high current density can effectively improve the dimensional accuracy of gold micro-parts. When the current density is increased to 0.6A / dm2, the precision of gold micro-parts can reach 5μm.