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制作高密度互连衬底依靠细线条印刷电路板技术,这种技术带来了非常严格的类似线间距变窄到50～15μm时的成品率问题。几何图形、形状、材料和表面抛光有关的细线条面板对光学检查提出了新的挑战,需要新的方法来保证可靠的检查。这种挑战是由生产因素产生的,例如导体线条的高宽比、在半添加加工中电镀线条的拱形顶部、有光泽或半透明的薄片和嵌入式无源元件等。其他的挑战来自物理和光学极限,即对于非常小的细线条缺陷需要达到很高的放大倍率才能查出。
The fabrication of high-density interconnect substrates relies on fine-line PCB technology, which results in a very tight yield rate when narrowing the line spacing to 50-15 μm. Thin line panels related to geometry, shape, material, and surface finish present new challenges to optical inspection and require new ways to ensure reliable inspection. This challenge is due to manufacturing factors such as the aspect ratio of the conductor lines, the arched top of plated lines in semi-additive processes, glossy or translucent sheets and embedded passive components. Other challenges come from physical and optical limits, where very high magnification needs to be detected for very small fine line defects.