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High-power vertical-cavity surface-emitting lasers(VCSELs) are processed using a wet thermal-selective oxidation technique.The VCSEL chips are packaged by employing three different bonding methods of silver solder,In-Sn solder,and metalized diamond heat spreader.After packaging,optical output power, wavelength shift,and thermal resistance of the devices are measured and compared in an experiment.The device packaged with a metalized diamond heat spreader shows the best operation characteristics among the three methods.The 200-μm-diameter device bonded with a metalized diamond heat spreader produces a continuous wave optical output power of 0.51 W and a corresponding power density of 1.6 kW/cm~2 at room temperature.The thermal resistance is as low as 10 K/W.The accelerated aging test is also carried out at high temperature under constant current mode.The device operates for more than 1000 h at 70℃,and the total degradation is only about 10%.
High-power vertical-cavity surface-emitting lasers (VCSELs) are processed using a wet thermal-selective oxidation technique. VCSEL chips are packaged by employing three different bonding methods of silver solder, In-Sn solder, and metalized diamond heat spreader. After packaging, optical output power, wavelength shift, and thermal resistance of the devices are measured and compared in an experiment. Device packaged with a metalized diamond heat spreader shows the best operation characteristics among the three methods. 200-μm-diameter device bonded with a metalized diamond heat spreader produces a continuous wave optical output power of 0.51 W and a corresponding power density of 1.6 kW / cm ~ 2 at room temperature. The thermal resistance is as low as 10 K / W. accelerated aging test is also carried out at high temperature under constant current mode. The device operates for more than 1000 h at 70 ° C, and the total degradation is only about 10%.