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采用SEM微观检测分析,结合产线工艺排查,对镀锡基板表面孔洞缺陷成因进行了分析。孔洞主要是由于炼钢保护渣卷入、异物压入、氧化铁皮残留和机械损伤造成的。为此,对结晶器流场进行优化,减少液面波动,定期开展热轧设备维检,增加粗轧除鳞道次,加开精轧机架间除鳞水,加强工序产线设备工况保障,有效降低了基板表面孔洞缺陷的发生率。
The microscopic inspection and analysis of SEM and the investigation of production line process were conducted to analyze the causes of hole defects on the surface of tinplate. The holes are mainly due to steel slag involvement, foreign matter into the metal oxide residue and mechanical damage caused. To this end, the mold flow field optimization to reduce the liquid level fluctuations, regular maintenance of hot-rolled equipment maintenance, increase roughing descaling step, plus fine-rolled descaling water between the machine frame to strengthen the production line equipment working conditions protection , Effectively reducing the incidence of holes on the surface of the substrate.