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在全国覆铜板行业协会精心组织下,我国覆铜板业众多专家与科技人员通过约一年的辛勤努力,一部展示我国覆铜板业当前技术水平反映当今覆铜板领域国际前沿技术发展的著作——《印制电路用覆铜箔层压板》即将在2002年春季出版发行。这是我国形成覆铜板产业以来第一部有关覆铜板制造技术的专著。并且,在目前世界上,像如此全面、系统、完整地荟萃了此领域的基本技术知识及当代最新技术水平的书籍,也是十分罕见。
CCCC in the country under the well-organized, China’s CCL industry, many experts and scientific and technical personnel through about a year of hard work, a showcase of China’s CCL industry’s current level of technology reflects today’s CCL international frontier technology development works - Printed Circuit Copper-clad Laminate will be forthcoming in the spring of 2002. This is the first book on the technology of manufacturing CCL since the formation of CCL industry in our country. And in the current world, it is rare for books like this that comprehensively and systematically and thoroughly incorporate the basic technical knowledge in this field and the latest state-of-the-art technologies in the field.