全球第二大计算机内存芯片厂商海力士半导体周三称,它已经开发出全球最大容量的单芯片封装DRAM内存芯片。海力士在声明中称,通过使用一种名为TSV(硅通孔技术)的新技术,海力士成功地在一个芯片封装中堆叠了8个2 GB DDR3 DRAM内存芯片。TSV技 Hynix Semiconductor, the world’s second-largest maker of computer memory chips, said Wednesday that it has developed the world’s largest single-chip packaged DRAM memory chip. Hynix said in a statement that Hynix succeeds in stacking eight 2 GB DDR3 DRAM memory chips in a single chip package using a new technology called TSV (Through Silicon Via Technology). TSV technology