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英飞凌科技股份公司进一步壮大其62mm封装IGBT模块阵容。新推出的功率模块可满足提高功率密度而不增加封装尺寸这一与日俱增的需求,这应归功于将更大面积的芯片和经改良的DCB衬底应用于成熟的62mm封装而得以
Infineon Technologies AG further expand its 62mm package IGBT module lineup. The new power module addresses the growing need to increase power density without increasing package size due to the larger die and modified DCB substrate used in a proven 62mm package