论文部分内容阅读
在流动的还原性气氛中,研究了共晶Sn3.8Ag0.7Cu焊料与不同Fe含量的Fe-Ni合金层的液固界面反应行为。结果表明:低Fe含量的Fe-83Ni镀层与共晶Sn3.8Ag0.7Cu焊料具有较快的液固界面反应速率,高Fe含量的Fe-53Ni镀层与共晶Sn3.8Ag0.7Cu焊料具有较慢的液固界面反应速率,在界面处可以观察到致密的FeSn2白色化合物层。而Fe-74Ni镀层与共晶Sn3.8Ag0.7Cu焊料的液固界面反应速率介于二者之间。当共晶Sn3.8Ag0.7Cu焊料与Fe-Ni镀层反应时,界面处生成的致密的FeSn2白色化合物,可以有效地阻止Fe-Ni镀层的快速消耗。
The liquid-solid interfacial reaction behavior of eutectic Sn3.8Ag0.7Cu solder and Fe-Ni alloy with different Fe contents was studied in flowing reductive atmosphere. The results show that the Fe-83Ni coating with low Fe content has a faster liquid-solid interfacial reaction rate with the eutectic Sn3.8Ag0.7Cu solder. The Fe-53Ni coating with high Fe content has a slower solution than the eutectic Sn3.8Ag0.7Cu solder Solid interface reaction rate, dense FeSn2 white compound layer can be observed at the interface. However, the liquid-solid interfacial reaction rate between the Fe-74Ni coating and the eutectic Sn3.8Ag0.7Cu solder is in between. When the eutectic Sn3.8Ag0.7Cu solder reacts with the Fe-Ni coating, the dense FeSn2 white compound formed at the interface can effectively prevent the rapid consumption of the Fe-Ni coating.