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分析了环氧胶粘剂纳米改性机理,用AJ-Ⅲa型原子力显微镜(AFM)研究经纳米SiO2、TiO2和SiC粒子改性后环氧胶粘剂截面图形及组团结构,测试及分析了环氧胶粘剂的耐温性能和抗拉、剪切强度。结果表明,SiO2、TiO2和SiC混合掺入质量分数为4%时,玻璃化温度提高了43℃,抗拉强度提高了17.7%,剪切强度提高了28.6%。用改性后的胶粘剂封装的光纤光栅(FBG)传感器,经实验室和现场测试,可以用于40MPa、300℃的工况环境。
The mechanism of nano-modification of epoxy adhesive was analyzed. The cross-section pattern and structure of epoxy adhesive modified by nano-SiO2, TiO2 and SiC particles were studied by AFM, and the resistance of epoxy adhesive was tested and analyzed Temperature performance and tensile, shear strength. The results show that when the mass fraction of SiO2, TiO2 and SiC is 4%, the glass transition temperature increases by 43 ℃, the tensile strength increases by 17.7% and the shear strength increases by 28.6%. The FBG sensor encapsulated with the modified adhesive can be used in 40MPa, 300 ℃ working environment after laboratory and field test.