半导体工业中甚大规模集成(VLSI)的进展同时要求改进光学检验显微术。随着临界线宽尺度的减少,这种要求已日益增长。今天,光学检验显微术对掩模对准和检测、晶片检验、探测、光刻、划线、粘结和包封芯片检验等半导体制造功能是必不可少的。 Advances in Very Large Scale Integration (VLSI) in the semiconductor industry also require improved optical inspection microscopy. With the reduction of the critical line width, this requirement has been growing. Optical inspection microscopy is essential today for semiconductor fabrication functions such as mask alignment and inspection, wafer inspection, probing, lithography, scribing, bonding and encapsulated wafer inspection.