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喷射成形高硅铝合金材料因具有低热膨胀系数、高热导率和低密度等特性,而成为一种具有广阔应用前景的新型电子封装材料。然而,喷射成形硅铝系合金中硅含量很高,其焊接性能较差。采用镀金、钎焊的方法研究了喷射成形硅铝合金材料的电镀及焊接性能;用扫描电镜对镀层及钎焊层形貌进行观察,用能谱仪对镀层及焊接层进行成分线扫描分析。结果表明,喷射成形硅铝合金材料易于电镀,电镀后镀层致密、均匀,与基体之间结合良好;焊接之前对喷射成形硅铝合金进行电镀可改善其与焊料之间的润湿性,材料焊接性能得以显著改善,可满足电子技术行业对封装材料的焊接工艺性能要求。
Spray forming high silicon aluminum alloy has become a new type of electronic packaging material with broad application prospect because of its low thermal expansion coefficient, high thermal conductivity and low density. However, the Si content of spray-formed Si-Al based alloys is high and their soldering performance is poor. The electroplating and soldering properties of spray-formed Si-Al alloy materials were studied by means of gold plating and brazing. The morphology of coatings and solder layers were observed by scanning electron microscopy. The composition and line scanning analysis of coatings and solder layers were carried out by EDS. The results show that the spray-formable Si-Al alloy material is easy to be electroplated, the coating is dense and uniform after electroplating, and the bond with the matrix is good. The electroplating of the Si-Al alloy spray-welded before welding can improve the wettability between the Si- Significantly improved performance to meet the electronic technology industry requirements of the packaging material welding process performance requirements.