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用于移动通信终端装置的发信功率放大器必须尽可能小型且高效率。为大量生产出廉价的产品,无调整装配是一个好方法。为满足这些要求,在一块25×20(mm)的氧化被基板上,试制了集中常数三级C类功率放大器。晶体管芯片直接装在基板上,尽量减小它的寄生电抗。在800MHz和900MHz频段,10W输出时,功率增益为23～24dB,总效率达40%以上。为减少制作放大器时产生的电路阻抗误差,对无源元件及其在基板上的安装方法进行了研究,并用无调整装配法试装了90台放大器。事实证明,大量生产时的无调整化是可行的。另外,种种可靠性试验表明,所试制的放大器可以适应车载无线终端机所承受的振动、温度等严酷环境。
The transmission power amplifier for the mobile communication terminal device must be as small and efficient as possible. For mass production of cheap products, no adjustment assembly is a good way. To meet these requirements, a three-level constant-current Class C power amplifier was prototyped on a 25 × 20 (mm) oxide substrate. Transistor chip mounted directly on the substrate, minimize its parasitic reactance. In 800MHz and 900MHz band, 10W output, the power gain of 23 ~ 24dB, the total efficiency of more than 40%. In order to reduce the impedance error of the circuit produced when making the amplifier, the passive components and the mounting method thereof on the substrate are studied, and 90 amplifiers are installed by trial-and-error assembly method. Facts have proved that mass production without adjustment is feasible. In addition, a variety of reliability tests show that the amplifier can be adapted to adapt to vehicle-mounted wireless terminal withstand vibration, temperature and other harsh environments.