以下是美国《激光和光电子学》记者就准分子激光在半导体工业方面的应用采访麻省Leitz-Image Microsystem 公司市场和销售副总裁 David Elliott 的谈话记录。记者:目前正在探求准分子激光进入半导体制造工艺某些生产领域的可能性。首先请您谈谈在光刻方面准分子激光目前达到的特征尺寸是多少?D.E.:最先进的装置在亚微米范围,分辩率约为0.6～0.8μm,套刻精度不到上述数值的一半,约0.25～0.3μm。如果能在一天内使分 The following is the United States, “Laser and Optoelectronics” reporter on the excimer laser in the semiconductor industry interview with Leitz-Image Microsystem, Mass., Vice president of marketing and sales David Elliott’s record. Reporter: At present, the possibility of excimer laser entering certain production areas of semiconductor manufacturing process is being explored. First of all, please talk about the current feature size of the excimer laser in photolithography? DE: The most advanced device in the sub-micron range, the resolution of about 0.6 ~ 0.8μm, not less than half of the set of precision, About 0.25 to 0.3 μm. If you can make points in a day