制备含有不同微量元素的四种钎料,研究微量元素对其润湿性和抗氧化性的影响。结果表明:合金元素Sb降低钎料的润湿性,使润湿面积减小31.5%,但这种元素能显著提高钎料的抗氧化性,氧化速率比基体钎料的降低了30%;Ce既能能提高钎料的润湿性,又能提高钎料的抗氧化性;Li能提高钎料的润湿性,但却极易被氧化,氧化速率比基体钎料增加了46%,综合考虑以添加微量元素Ce为最优。 Four kinds of brazing filler metals containing different trace elements were prepared to study the effect of trace elements on their wettability and oxidation resistance. The results show that alloying element Sb can reduce the wettability of the solder and decrease the wetting area by 31.5%. However, this element can significantly improve the oxidation resistance of the solder with the oxidation rate reduced by 30% Both can improve the solder wettability, but also improve the solder oxidation resistance; Li can improve the solder wettability, but it is easily oxidized, oxidation rate than the base solder increased by 46%, integrated Considered to add the best trace element Ce.