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采用有限元方法模拟研究了基体预热下多道多层激光沉积修复GH4169合金温度场和残余应力的分布及变化规律。结果表明,基体经300℃预热后,修复区温度梯度明显减小;Von Mises热应力最大降幅为13.2%,x方向热应力最大降幅为12.9%,y方向热应力最大降幅为20.1%。进行了在相同条件下激光沉积修复试验和应力测试,残余应力模拟结果与测试结果最大误差为8.6%,表明模拟与测试结果是基本吻合的。
The distribution and variation of temperature field and residual stress of GH4169 alloy were studied by finite element method. The results show that the temperature gradient of the repaired area decreases obviously when the matrix is preheated at 300 ℃. The maximum thermal stress Von Mises decreases 13.2%, the maximum thermal stress decreases 12.9% and the maximum thermal stress decreases 20.1%. The laser deposition repair test and stress test were carried out under the same conditions. The maximum error between the residual stress simulation results and the test results was 8.6%, indicating that the simulation and test results are basically consistent.