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军用数字設备的微模組件电路结构的可能性已被MICROPAC計算机的設計、制造和試驗所証实。因为MICROPAC計划的副产品,对于合理装配的設备設計技术和相互連接,数字微模組件的热传导业已得到发展,并在本文加以叙述。业已表明,微模組件安装和相互連接的电路书頁板技术,用强迫空气冷却有效地提高了热传导,提高了安装密度,不用多层布线就允許微模組件相互連接布线。裝配、布线、高密度微模組件設备的維修也已經得到了发展,并且也在本文加以介紹。最后还指出,对包装半个电子微模組件的技术正由1958年的概念向着設計多层集成电路或固体电路的微模組件技术的1962年的概念发展。这两种概念或技术混合起来,将来即可制成速度更快、可靠性更高和造价更低廉的完全微模組件化的軍用数字設备。
The possibility of circuit structure for the micromodules of military digital equipment has been confirmed by the design, manufacture and testing of MICROPAC computers. Because of the by-product of the MICROPAC program, the heat transfer of digital micromodules has been developed for well-designed device design techniques and interconnections and is described in this article. It has been shown that circuit board technology for mounting and interconnecting micromodule components effectively enhances thermal conduction with forced air cooling and improves mounting density without the need for multiple layers of wiring to allow the micromodules to interconnect with each other. Maintenance of assembly, cabling, and high-density micromodule devices has also been developed and is also covered in this article. Finally, it was pointed out that the technology for packaging half of the electronic micromodules was being developed from the 1958 concept towards the 1962 concept of micromodule technology for designing multilayer integrated circuits or solid-state circuits. Together, these two concepts or technologies make it possible to create fully micromodular, military digital devices that are faster, more reliable and less expensive in the future.