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尽管器件钝化技术已经改善,但密封管壳仍然得到广泛应用;虽然封装技术还落在器件生产的发展后面,但是自动化生产将最终实现。
Although device passivation has been improved, hermetically sealed housings are still widely used; and although packaging technology is still behind the development of device manufacturing, automated production will eventually come to fruition.