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Particles can be removed from a silicon surface by means of irradiation and a laser plasma shock wave.The particles and silicon are heated by the irradiation and they will expand differently due to their different expansion coefficients,making the particles easier to be removed.Laser plasma can ionize and even vaporize particles more significantly than an incident laser and,therefore,it can remove the particles more efficiently.The laser plasma shock wave plays a dominant role in removing particles,which is attributed to its strong burst force.The pressure of the laser plasma shock wave is determined by the laser pulse energy and the gap between the focus of laser and substrate surface.In order to obtain the working conditions for particle removal,the removal mechanism,as well as the temporal and spatial characteristics of velocity,propagation distance and pressure of shock wave have been researched.On the basis of our results,the conditions for nano-particle removal are achieved.
Particles can be removed from a silicon surface by means of irradiation and a laser plasma shock wave. The particles and silicon are heated by the irradiation and they will expand differently due to their different expansion coefficients. Making the particles easier to be removed. Laser plasma can ionize and even vaporize particles more significantly than an incident laser and, therefore, it can remove the particles more efficiently.The laser plasma shock wave plays a dominant role in removing particles, which is attributed to its strong burst force. pressure of the the laser plasma shock wave is determined by the laser pulse energy and the gap between the focus of laser and substrate surface. order to obtain the working conditions for particle removal, the removal mechanism, as well as the temporal and spatial characteristics of velocity, propagation distance and pressure of shock wave have been researched. On the basis of our results, the conditions for nano-particle removal are achieved.