论文部分内容阅读
通过原位反应近熔点铸造法制备TiC/Cu基复合材料,利用光学显微镜(OP)、扫描电子显微镜(SEM)和能谱分析(EDS)对晶粒形貌、尺寸及成分进行分析,用Origin软件绘制TiC/Cu基复合材料的相对电导率和维氏硬度与原位TiC颗粒含量的关系曲线。实验结果表明,通过Ti-C-Cu体系之间的原位反应生成尺寸为1~2μm的TiC颗粒,均匀分布在基体中。随着原位TiC颗粒含量的增加,复合材料的硬度增强的同时其相对电导率下降。
TiC / Cu matrix composites were prepared by in-situ reaction near melting point casting. The morphology, size and composition of the TiC / Cu composites were analyzed by optical microscope (OP), scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS) Software plot TiC / Cu-based composites relative conductivity and Vickers hardness and in situ TiC particle content curve. The experimental results show that TiC particles with the size of 1 ~ 2μm are formed by in-situ reaction between Ti-C-Cu systems and distributed uniformly in the matrix. With the increase of the content of in situ TiC particles, the hardness of the composites increases while the relative electrical conductivity decreases.