长期以来,要想增加芯片的容量, 传统的做法是扩大芯片的体积 或提高芯片上的器件集成度,然而芯片的体积与集成度增大均有一定的限度。许多半导体工程师正梦寐以求第三种方法:在一个存储器单元内存储一条以上的信息,使芯片在尺寸与密度几乎没有多大变化的条件下,存储能力比原来提高一倍。1997年9月,这种梦想已由Intel公司变成现实。 9月17日,当Intel向世界宣布这个神奇创举时,一时间仿佛重石击水,在业界乃至整个社会掀起一片波澜,由新华社纽约记者发向中国的这条消息,被国内主要的电子及公众媒体刊载。 For a long time, in order to increase the chip capacity, the traditional approach is to expand the chip size or increase the device integration on the chip. However, the chip size and integration have a certain limit. Many semiconductor engineers are dreaming about a third approach: storing more than one piece of information in a single memory cell, doubling the memory capacity of the chip with little or no change in size or density. In September 1997, this dream has come true from Intel. On September 17, when Intel announced this magical initiative to the world, it seemed as if a heavy blow hit the industry and even society as a whole. The news sent by Xinhua News Agency reporters from Xinhua was sent by China’s major electronics and public sectors Media published.