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本文研究报道了Pyrex7740玻璃湿法腐蚀通孔技术。将四寸硅玻璃键合圆片的玻璃衬底减薄,并在玻璃上分别制备PECVD SiC、W/Au和PECVD多晶硅三种不同掩膜及其开口,最终利用40%HF腐蚀实现玻璃通孔。整个工艺过程与IC工艺兼容,并可进行圆片级批量加工。观察并研究纵向和横向腐蚀过程和通孔形貌,对比三种不同腐蚀掩膜掩蔽效果。本文研究结果为圆片级密封封装及其它MEMS器件奠定了基础。
This paper reports the glass wet etching of Pyrex7740 through-hole technology. Four-inch silicon-glass bonded wafer glass substrates were thinned, and three different PECVD SiC, W / Au and PECVD polysilicon masks and their openings were prepared on the glass, respectively, and the glass was finally finished with 40% HF etching . The entire process is compatible with the IC process, and wafer-level batch processing. Observation and study of vertical and horizontal etching process and through-hole morphology, contrasting three different mask masking effect. The results of this paper lay the foundation for wafer level seal packaging and other MEMS devices.