论文部分内容阅读
超高速工作的大规模集成电路的发展,使其散热问题重新作为迫切需要解决的问题而成了议论的对象。大规模集成电路的散热处理,与以前由集成电路和晶体管所构成的电子设备的情况相比,因热密度飞速增高,故成了非常困难的问题。即使从封装方面看,要将排列在印制板上几十个元件一起冷却的做法变成冷却几个组件化的封装,也必须从根本上从新研究散热方法。本文介绍具有高效率传热特性的众所周知的热管的适用性以及集成电路等的试制现状。
The development of large-scale integrated circuits operating at very high speeds has made it a subject of debate as an issue that urgently needs to be solved. The heat dissipation of LSIs is a very difficult problem due to the rapid increase in heat density as compared with the case of electronic devices that are conventionally composed of integrated circuits and transistors. Even from the packaging point of view, to be arranged in the printed circuit board dozens of components with the practice of cooling into several components of the cooling package, but also fundamentally new cooling method. This article describes the applicability of well-known heat pipes with high efficiency heat transfer characteristics and the status quo of the fabrication of integrated circuits.