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近日,半导体制造商英飞凌科技股份有限公司与半导体代工业的全球领导者联华电子股份有限公司宣布,将其制造合作伙伴关系扩大到汽车应用的功率半导体。在扩大合作伙伴关系之前,联华电子为英飞凌生产逻辑芯片的合作关系已超过15年。根据最近签署的协议,2家公司将合力将英飞凌的汽车级品质智能功率技术(SPT9)转移给联华电子并将生产合同扩大到300mm晶圆。双方计划于2018年初在联华电子的300mm工厂开始生产英飞凌专有的在单一芯片上整合微控制器智能和功率技术
Recently, the semiconductor manufacturer Infineon Technologies AG and the world leader in semiconductor foundry Lianhua Electronics Co., Ltd. announced that it will expand its manufacturing partnership to automotive power semiconductor applications. Prior to expanding its partnership, UMC worked with Infineon Technologies Logic for more than 15 years. Under the recently signed agreement, the two companies will work together to move Infineon’s automotive-grade Smart Power Technology (SPT9) to UMC and extend its manufacturing contract to 300mm wafers. Both companies plan to begin production at UMC’s 300mm plant in early 2018 Infineon’s proprietary integration of microcontroller intelligence and power technology on a single chip