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脉冲电镀的概念 “脉冲电镀”是一个通用的术语,它用来描述使用常规镀槽或特制镀槽、采用脉冲电流的电镀系统。因此,它与普通电镀的不同点就在于采用脉冲电源。 能产生上升时间约为10～75微秒,基本频率成分为200～5,000Hz的方“波”电流脉冲的任何整流器通常都称为“脉冲整流器”、“脉冲电流”或“脉冲电镀装置”,这就是通常用于先进的脉冲电镀的电源的型式。
The concept of pulsed electroplating “Pulsed electroplating” is a generic term used to describe electroplating systems that use pulsed current using conventional plating baths or specialty plating baths. Therefore, it is different from the ordinary plating is the use of pulse power. Any rectifier capable of generating square “wave” current pulses with a rise time of about 10-75 microseconds and a fundamental frequency component of 200-5,000 Hz is commonly referred to as a “pulse rectifier”, “pulse current” or “pulse plating device” This is the type of power supply commonly used for advanced pulse plating.