在半导体生产中,人们不断要求速度更快、功能更强、价格更低的集成电路。增加产生芯片的实际使用的晶圆片尺寸,就能加大制造集成电路的可用面积。在集成电路大规模生产的初期,生产芯片的半导体晶圆片直径大约3英寸(75mm)。当芯片生产发展经过二十年后,工业用晶圆片尺寸才增加到4英寸(100mm),然后为5英寸(125mm),1980年年底达到6英 In semiconductor manufacturing, people are continually demanding integrated circuits that are faster, more capable and less expensive. Increasing the size of the wafer actually used to create the chip can increase the available area for manufacturing integrated circuits. In the early stages of mass production of integrated circuits, the semiconductor wafers for chip production were approximately 3 inches (75 mm) in diameter. After two decades of chip production development, the industrial wafer size increased to 4 inches (100 mm), then to 5 inches (125 mm), to 6 inches by the end of 1980