针对金刚石薄膜用于微电子器件和微机械器件的共性关键技术问题 ,总结了近年来这些方面的研究成果 ,包括 :用交流 直流负偏压微波等离子化学气相沉积 (MPCVD)在绝缘SiO2衬底上实现金刚石高密度成核 ,高成核选择比的金刚石选择生长技术 ,铝掩模氧反应离子束刻蚀金刚石薄膜的图形化技术 ,以及与金刚石生长工艺兼容的牺牲层、绝缘层技术等 Aiming at the common key technologies of diamond films for microelectronic devices and micromechanical devices, the research results of these aspects in recent years are summarized, including the following: using AC-DC negative bias microwave plasma chemical vapor deposition (MPCVD) on an insulating SiO2 substrate Diamond selective growth technology for diamond high density nucleation and high nucleation selectivity, patterning technology for aluminum mask oxygen reactive ion etching diamond film, and sacrificial layer and insulation technology compatible with diamond growth process