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The(submicron+micron) Si Cp-reinforced magnesium matrix composite was fabricated by stir casting. After the application of forging and extrusion, the interface between Si Cp and Mg in the composite was investigated by transmission electron microscopy. Results show that the interfacial characterization was different at the interfaces of micron-Si Cp/Mg and submicron-Si Cp/Mg. While most interfaces between micron-Si Cp and Mg were clean, the precipitated Mg17Al12 phase as well as dispersedly distributed nano-Mg O particles was observed at some interfaces. Unlike the interface between micron-Si Cp and Mg, no interfacial reaction product was found at the interface between submicron-Si Cp and Mg in the present study. Besides, the specific orientation relationships were found at the interfaces between submicronSi Cp and Mg, which was thought to have developed during hot deformation process. At the fracture surface of the composite, the microcracks were found at the interface between micron-Si Cp and Mg, while the interfacial bonding between submicron-Si Cp and Mg was very well.
The (submicron + micron) Si Cp-reinforced magnesium matrix composite was fabricated by stir casting. After the application of forging and extrusion, the interface between Si Cp and Mg in the composite was investigated by transmission electron microscopy. Results show that the interfacial characterization was different at the interfaces of micron-Si Cp / Mg and submicron-Si Cp / Mg. While most of the interfaces between micron-Si Cp and Mg were clean, the precipitated Mg17Al12 phase as well as dispersedly distributed nano-Mg O particles was observed at some interfaces. Unlike the interface between micron-Si Cp and Mg, no interfacial reaction product was found at the interface between submicron-Si Cp and Mg in the present study. Besides, the specific orientation relationships were found at the interfaces between submicron Si Cp and Mg, which was thought to have developed during hot deformation process. At the fracture surface of the composite, the microcracks were found at the interface between micron-S i Cp and Mg, while the interfacial bonding between submicron-Si Cp and Mg was very well.