论文部分内容阅读
为研究激光焊接工艺对球栅阵列焊点焊接连接特性的影响,应用Ansoft平台的HFSS三维电磁场仿真软件和Designer平面激光仿真软件建立标准BGA焊点的激光焊接仿真模型,得出焊点尺寸的改变对激光性能的影响。结果表明:随着电流源电流值的增加,电极电流值基本呈现单调增加的变化趋势,电流放大的三极管电流源的电流值应控制在80μA以上。焊点高度的增大使得放大倍数明显减小,相比较焊点高度0.6、0.55 mm时,电流放大倍数在焊点高度0.50 mm的情况下明显偏大。联合仿真结果与实际测量结果误差在10%范围内。相比较HFSS单独仿真,联合仿真结果精度更准确。
In order to study the influence of laser welding process on the welding connection characteristics of ball grid array solder joints, a laser welding simulation model of standard BGA solder joints was established by using Ansoft platform HFSS 3D electromagnetic field simulation software and Designer plane laser simulation software. Effect on laser performance. The results show that with the increase of the current source current, the electrode current shows a monotonically increasing trend. The current value of the current amplifier transistor should be controlled above 80μA. The increase of the spot height makes the magnification decrease obviously. Compared with the spot height of 0.6 and 0.55 mm, the current magnification is obviously larger when the spot height is 0.50 mm. Co-simulation results and the actual measurement error is within 10%. Compared with HFSS simulation alone, the accuracy of joint simulation is more accurate.