赛灵思公司(Xilinx)宣布推出堆叠硅片互联技术,即通过在单个封装中集成多个FPGA芯片,实现突破性的容量、带宽和功耗优势,以满足那些需要高密度晶体管和逻辑,以及需要高处理能力和带宽性能的应用。通过采用3D封装技术和硅通孔技术,赛灵思28 nm 7系列FPGA目标设计平台所能满足的的资源需求,是单芯片FPGA所能达到的两倍。这种创新的平台方法不仅使赛灵思突 Xilinx today announced the introduction of stacked silicon interconnect technology that enables breakthrough capacity, bandwidth, and power consumption by integrating multiple FPGA chips in a single package for applications that require high-density transistors and logic, and Applications that require high processing power and bandwidth performance. Through the use of 3D packaging technology and through-silicon via technology, Xilinx 28nm 7 series FPGA target design platform can meet the resource requirements, double the single-chip FPGA can achieve. This innovative platform approach not only makes Xilinx a surprise