为解决一些更薄倒装芯片封装相关的难题,汉高公司推出了一种新型底部填充材料,旨在通过控制芯片和基板翘曲以降低封装产品的应力。新材料乐泰ECCOBOND UF 8840是一种性能优异的底部填充材料,专为现代半导体倒装芯片封装的各种需求而设计。由于基板和倒装芯片具有不同的热膨胀系数(CTE)特性,因此,在进行热加工(二次回流)时,封装后的产品可能会发生向上或向下翘曲,最终导致产品 To address some of the more difficult problems associated with more flip-chip packaging, Henkel has introduced a new underfill material designed to reduce stress on packaged products by controlling chip and substrate warpage. New Materials Loctite The ECCOBOND UF 8840 is a high performance underfill material designed for the needs of modern semiconductor flip chip packaging. Due to the different coefficient of thermal expansion (CTE) characteristics of the substrate and the flip-chip, the packaged product may warp up or down during thermal processing (secondary reflow), eventually leading to the product