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介绍了额定电压达4500V、额定电流达2000A的新型压接式封装IGBT(PPI)。在这种新器件的开发期间,特别强调系统制造商易于使用的可选用性。为了便于把压接式封装的IGBT紧固在长的骨架上,其机械设计是精心优化的。即使在骨架上的紧固会发生某些不均匀现象,这种压接式封装的IGBT因其独特的设计,对每个芯片都用单独的压针压紧,因而它们都会发挥其完善的功能。进而,材料的选择也得到优化,以保证在野外也能达到极高的可靠性。在功率循环次数及在故障情况下运行之间的折衷平衡点亦已被推向新的限界。这里的IGBT和二极管二者的芯片都基于SPT(软穿通)技术。先进的IGBT平面元胞设计与二极管精密的寿命控制工程相结合,这样的芯片就具备了崭新的安全工作区。这就大大便利了系统的设计,使原先使用的夹具或减振器成为过时。
A new type of crimp package IGBT (PPI) with a rated voltage of 4500V and a rated current of 2000A is introduced. During the development of this new device, special emphasis was put on the ease of use of system manufacturers. In order to facilitate the crimp-type packaged IGBT fastened to the long skeleton, its mechanical design is carefully optimized. Even with some unevenness in the fastening of the bobbins, these crimp-type packaged IGBTs have their own unique design that uses a separate pin for each chip so they all perform their full function . In turn, the choice of material is also optimized to ensure extremely high reliability in the field. The trade-off between the number of power cycles and the operation in case of a fault has also been pushed to new limits. The chips for both IGBTs and diodes here are based on SPT (soft punch-through) technology. The combination of advanced IGBT planar cell design and diode precision life control engineering provides a new, secure workspace for such chips. This greatly facilitates the design of the system, making the originally used fixture or shock absorber obsolete.