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无线通信产品专用射频集成电路(RFIC)供应商美国威讯联合半导体(RF Micro Devices)公司,日前将其北京新厂“威讯联合半导体(北京)有限公司”落户北京经济科技开发区的北京星网工业园区。新工厂包含一个测试及卷带封装作业系统和一个销售与客户支持办事处。业务重点是从事元器件测试及装配,并在当地向中国手机制造商,原始设计制造商和国际手机制造商在中国的营运提供本地化支持。威讯联合半导体公司从2001年11月起开始建设北京测试及卷带封装工厂,并于2002年9月开始发运产品,截止到2002年底,威讯联合半导体公司已在这家新工厂测试和卷带封装一千万个模块。该工厂开业首季度营业额就已占威讯
RF Micro Devices, Inc., a provider of radio frequency integrated circuits (RFICs) for wireless communications products, recently set up its new factory in Beijing “Weixun Semiconductor (Beijing) Co., Ltd.” in Beijing Economic and Technological Development Zone Beijing Star Network Industrial Park. The new plant includes a test and tape and reel packaging operating system and a sales and customer support office. The business focus is on component testing and assembly, and locally providing support for the operation of Chinese handset manufacturers, original design manufacturers and international handset manufacturers in China. Weixin Semiconductor Co., Ltd. started construction of the Beijing test and tape-tape packaging plant since November 2001 and began shipping products in September 2002. By the end of 2002, Weixin Semiconductor Co., Ltd. had been testing and rolling out the new factory With a package of 10 million modules. The factory opened its first quarter sales already accounted for Weixin