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基于MEMS微细加工工艺,利用磁控溅射方法在Si基片上制备了不同Cu层宽度弯曲型三明治结构的FeCuNbCrSiB/Cu/FeCuNbCrSiB多层膜,在频率1～40MHz下研究了Cu层宽度对多层膜的应力阻抗效应的影响。结果表明,弯曲型三明治结构多层膜的应力阻抗(SJ)效应随Cu层宽度的变化有明显的变化,在频率5MHz、基片自由端在y轴方向偏移的距离h为1500μm时,当Cu层宽度为0.4mm时,应力阻抗效应达-25%左右。
Based on MEMS micro-fabrication process, FeCuNbCrSiB / Cu / FeCuNbCrSiB multilayers with different Cu layer width and curved sandwich structure were prepared on Si substrate by magnetron sputtering. The effects of Cu layer width on multi-layer Effect of Stress Impedance Effect of Membrane. The results show that the stress-resistance (SJ) effect of the curved sandwich structure multilayer film changes obviously with the variation of the width of the Cu layer. When the distance h at the frequency 5MHz and the free end of substrate in the y-axis direction is 1500μm, Cu layer width of 0.4mm, the stress resistance effect of about -25%.