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通过离子束溅射辅助沉积技术(IBSAD)制备了掺杂Cu元素的Pt基催化膜电极,并对电极进行了退火处理。利用EDS及XRD检测了电极的成分及结构,通过循环伏安法测试电极的析氢活性。结果表明:掺杂Cu的膜电极中形成了PtCu合金固溶体,且参与合金化的程度随退火温度而变化,显示退火温度是影响PtCu金属合金化的关键因素;经400℃退火的试样电极的交换电流密度较原样提升约11.6%,析氢峰电位降低,说明金属Cu参与到Pt基催化剂的合金化过程能有效提高催化性能。
The Cu-doped Pt-based catalytic membrane electrode was prepared by ion beam sputtering assisted deposition technique (IBSAD), and the electrode was annealed. The composition and structure of the electrode were measured by EDS and XRD, and the hydrogen evolution activity of the electrode was measured by cyclic voltammetry. The results show that the solid solution of PtCu alloy is formed in the Cu-doped membrane electrode and the degree of alloying with the annealing temperature changes. It shows that the annealing temperature is the key factor affecting the alloying of PtCu metal. The exchange current density is about 11.6% higher than that of the original sample, and the potential of hydrogen evolution peak decreases. It is concluded that the alloying of Cu onto the Pt-based catalyst can effectively improve the catalytic performance.