论文部分内容阅读
使用Muggianu模型计算Cu-Al-Zn三元形状记忆合金的热力学性能,通过实验研究其显微组织、硬度和导电性。使用Thermo-Calc软件计算293 K等温截面图,采用X射线衍射、光学显微镜、扫描电镜(SEM)和X射线能谱分析(EDX)、硬度和导电性测试对其性能进行表征。热力学计算结果表明:在所有研究合金中,Cu与Al和Zn具有优良的混溶性。样品的显微结构分析表明其结构由大的多边形晶粒组成。
The Muggianu model was used to calculate the thermodynamic properties of the Cu-Al-Zn ternary shape memory alloy. The microstructure, hardness and electrical conductivity of the Cu-Al-Zn ternary shape memory alloy were experimentally studied. The 293 K isothermal section was calculated using Thermo-Calc software and characterized by X-ray diffraction, optical microscopy, scanning electron microscopy (SEM) and X-ray energy dispersive spectroscopy (EDX), hardness and conductivity testing. The thermodynamic calculation results show that Cu has excellent miscibility with Al and Zn in all the studied alloys. Microstructural analysis of the sample showed that its structure consisted of large polygonal grains.