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采用自行设计制备的Cu-Sn-Ti-Ni活性粉末钎料,在钎焊温度890~930℃,保温时间5~20 min的条件下,对Al2O3陶瓷与Cr12钢进行真空钎焊试验,利用扫描电镜和能谱分析对钎焊界面的微观组织进行了分析。结果表明:钎料与两侧母材润湿良好并形成良好的冶金界面结合;钎焊过程中,钢母材中的Fe元素向钎料层中扩散,钎料中的Ti元素向母材两侧扩散并聚集,在钎料层钢母材侧生成Ti Fe2和Ti C化合物。对接头抗剪强度的分析结果表明,在钎焊温度890℃、保温时间10 min的条件下,接头的抗剪强度最高,达118 MPa。
The brazing temperature of 890 ~ 930 ℃ and holding time of 5 ~ 20 min were used to test the vacuum brazing of Al2O3 ceramic and Cr12 steel by using self-designed Cu-Sn-Ti-Ni active powder solder. Electron microscopy and energy spectrum analysis of the brazing interface microstructure were analyzed. The results show that the solder is well wetted with the base metal on both sides and forms a good metallurgical interface. In the brazing process, the Fe element in the steel base material diffuses into the solder layer, and the Ti element in the solder to the base metal two Side diffusion and aggregation, TiFe2 and TiC compounds are formed on the steel base material side of the brazing material layer. The results of shear strength analysis of the joint showed that the shear strength of the joint was the highest at 118 ℃ when the brazing temperature was 890 ℃ and the holding time was 10 min.