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采用离子注入、多层欧姆接触金属结构、干法刻蚀、г形栅、空气桥、通孔接地和电镀热沉等先进技术,在直径50mmGaAs片上制作了总栅宽为9.6mm的功率场效应晶体管芯片。用4枚这种芯片并联,在其输入端和输出端分别加入内匹配电路,制成了C频段内匹配功率场效应晶体管。在大于500MHz的带宽内,1dB增益压缩输出功率达18W,1dB压缩增益为8.3dB,功率附加效率达30%。
The power field with a total gate width of 9.6 mm was fabricated on a 50 mm diameter GaAs wafer using advanced techniques such as ion implantation, multilayer ohmic contact metal structures, dry etching, г grid, air bridge, via ground and plating heat sink Effect Transistor Chip. With four such chips in parallel, respectively, in its input and output are added within the matching circuit, made of C-band matching power field-effect transistors. In the bandwidth of more than 500MHz, 1dB gain compression output power of 18W, 1dB compression gain of 8.3dB, additional power efficiency of 30%.