随着大功率电气、电子产品的快速发展,必然出现越来越多的发热问题,产生的热量又会引发产品的功效降低,使用寿命缩短及造成多种事故等问题。因此采用有效的方法解决结构散热和研制高导热的材料成为当务之急。 With the rapid development of high-power electrical and electronic products, more and more heating problems will inevitably occur. The generated heat will lead to the reduction of product efficacy, the shortened service life and many accidents. Therefore, the use of effective methods to solve the structural heat dissipation and the development of high thermal conductivity materials become a top priority.