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照相蚀刻工艺可以部分代替传统的机械冲压工艺,加工面积可由几平方毫米至一个平方米。加工材料的厚度为0.01～1毫米,加工精度可达微米级,可在0.01～0.02毫米厚的金属箔上加工直径0.003～0.005毫米的小孔。这种工艺在国外称之为“微细加工”。一、基本工艺该工艺实际上是印刷照相制版工艺的一个派生,工艺上有相似之处。主要工艺流程为:绘图→照相→曝光→蚀刻(化学式电蚀)。
Photographic etching process can partially replace the traditional mechanical stamping process, the processing area can be a few square millimeters to a square meter. Machined material thickness of 0.01 to 1 mm, the processing accuracy of up to microns, 0.01 ~ 0.02 mm thick metal foil can be processed on the diameter of 0.003 to 0.005 mm holes. This process is called “microfabrication” abroad. First, the basic process The process is actually a derivative of the printing plate making process, the process has similarities. The main process is: drawing → photography → exposure → etching (chemical erosion).