论文部分内容阅读
采用半导体激光作为焊接热源,对高碳马氏体不锈钢85Cr17和奥氏体不锈钢0Cr18Ni9进行对接焊试验,分析了焊接接头的显微组织并测试了显微硬度和拉伸强度。结果表明:采用半导体激光焊接工艺可实现85Cr17和0Cr18Ni9的对接焊,获得连续、平整的焊缝;焊缝中心区域主要为等轴晶,近中心区为柱状晶与树枝晶的混合组织,靠近基体侧的焊缝边缘区为柱状晶组织;焊缝区的平均硬度高于两种基材;拉伸试样均断在85Cr17侧热影响区,未焊透时,焊接接头抗拉强度达到0Cr18Ni9母材的88%,焊透时,抗拉强度达到0Cr18Ni9母材的95%以上。
The semiconductor laser was used as the heat source for welding butt welding of high carbon martensitic stainless steel 85Cr17 and austenitic stainless steel 0Cr18Ni9. The microstructure of the welded joints was analyzed and the microhardness and tensile strength were tested. The results show that the butt welding of 85Cr17 and 0Cr18Ni9 can be achieved by using semiconductor laser welding technology, and the continuous and smooth weld seam can be obtained. The center of the weld is mainly equiaxed and the near center is the mixed structure of columnar and dendrite. The edge of the weld side of the columnar columnar grain structure; the average hardness of the weld zone is higher than the two substrates; tensile specimens are off in the heat affected zone 85Cr17 side, not welded, the tensile strength of welded joints reached 0Cr18Ni9 mother 88% of the material, penetration, tensile strength reached 0Cr18Ni9 base metal 95% or more.