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采用非等温差示扫描量热(DSC)法对纳米二氧化硅/环氧树脂/双马来酰亚胺/氰酸酯(nano-SiO2/EP/BMI/CE)树脂进行了固化反应动力学和固化工艺研究。通过Kissinger法和Ozawa法求得了nano-SiO2/EP/BMI/CE树脂体系固化反应动力学的表观活化能。结果表明:改性CE树脂体系的固化工艺参数为凝胶温度112℃、固化温度195℃及后处理温度213℃,进而确定了改性CE树脂体系的最佳固化工艺条件为“150℃/3 h→180℃/3 h→200℃/2 h”;改性CE树脂体系的平均表观活化能为59.90 kJ/mol。
The curing reaction kinetics of nano-silica / epoxy / bis-maleimide / cyanate (nano-SiO2 / EP / BMI / CE) resin was investigated by non-isothermal differential scanning calorimetry And curing process research. The apparent activation energy of the curing reaction kinetics of nano-SiO2 / EP / BMI / CE resin was obtained by Kissinger method and Ozawa method. The results showed that the curing process parameters of modified CE resin system were as follows: the gel temperature of 112 ℃, the curing temperature of 195 ℃ and the post-treatment temperature of 213 ℃. The optimum curing conditions of the modified CE resin system were determined to be “150 ℃ / 3 h → 180 ℃ / 3 h → 200 ℃ / 2 h ”. The average apparent activation energy of the modified CE resin system was 59.90 kJ / mol.