本文讨论了半导体制冷器中电偶元件尺寸的缩小与制冷性能的关系。发现尺寸的缩小,除受到材料的性质和工艺条件的限制外,并不会引起制冷器主要性能的改变。据此,同时也考虑到半导体材料的特点及工艺现状,我们提出了半导体制冷器集成化的设想,并对实现这种器件的可能性进行了初步探讨。 This article discusses the relationship between the reduction in size of the galvanic element and the cooling performance of a semiconductor refrigerator. It is found that the reduction of size does not cause the main performance of the refrigerator to change unless it is limited by the nature of the material and the process conditions. Accordingly, taking into account the characteristics of semiconductor materials and the current status of the process, we put forward the idea of ​​semiconductor cooler integration, and to explore the possibility of implementing this device.