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采用化学接枝技术,利用硅烷偶联剂γ-氨丙基三乙氧基硅烷(KH-550)、水合肼改性氧化石墨烯(GO)制备功能型石墨烯(FG)。将FG与苯基硅橡胶混合,采用氢化硅烷化法,在铂催化剂作用下制备了一种发光二极管(LED)封装用FG/苯基硅橡胶复合材料,考察了改性后FG结构、表面官能团变化以及其用量对FG/苯基硅橡胶复合材料力学性能及光学性能的影响,并分析了FG/苯基硅橡胶复合材料的微观相态及其热稳定性。结果表明:经KH-550改性后的FG表面附有特殊官能团,能提高其在苯基硅橡胶中的分散性。当苯基硅橡胶中引入0.010 0wt%FG时,FG/苯基硅橡胶复合封装材料的透光率仍可达到85%以上,耐紫外老化性能和力学性有明显提高。FG/苯基硅橡胶复合材料的热分解温度为690℃、GO/苯基硅橡胶复合材料的热分解温度为623℃,而纯苯基硅橡胶的热分解温度为491℃,且FG/苯基硅橡胶复合材料的放热量始终比纯苯基硅橡胶略低。苯基硅橡胶中引入0.010 0wt%改性的FG,材料热分解温度提高了200℃,放热量有所减少,能更好满足功能型LED复合封装材料热稳定性能要求。
The functional graphene (FG) was prepared by chemical grafting using silane coupling agent γ-aminopropyltriethoxysilane (KH-550) and hydrazine hydrate modified graphene oxide (GO). FG and phenyl silicone rubber composite materials were prepared by the hydrosilylation method and FG / phenyl silicone rubber composite materials for LED packaging were prepared by platinum catalyst. The effects of FG structure, surface functional groups The effects of the amount of the modified FG / phenylsiloxane on the mechanical properties and optical properties of FG / phenyl silicone rubber composites were investigated. The microstructure and thermal stability of FG / phenyl silicone rubber composites were also analyzed. The results show that the surface of FG modified by KH-550 has special functional groups, which can improve its dispersibility in phenyl silicone rubber. When 0.010wt% FG is introduced into the phenyl silicone rubber, the light transmittance of the FG / phenyl silicone rubber composite packaging material can still reach more than 85%, and the UV aging resistance and mechanical properties are obviously improved. The thermal decomposition temperature of FG / phenyl silicone rubber composites was 690 ℃, the thermal decomposition temperature of GO / phenyl silicone rubber composites was 623 ℃, while the thermal decomposition temperature of pure phenyl silicone rubber was 491 ℃, and FG / benzene Base silicone rubber composite heat release is always slightly lower than pure phenyl silicone rubber. Phenyl silicone rubber introduced 0.010wt% modified FG, the material thermal decomposition temperature increased by 200 ℃, the heat emission decreased, to better meet the functional requirements of the thermal stability of LED composite packaging materials.