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本文对SMT组装工艺及焊接方法作了主要介绍,并对适用场合作了小结,可供电路设计及工艺人员参考。组装工艺是表面安装技术(SMT)的核心部分。它主要研究用什么方法及工艺流程将表面安装器件(SMD)焊接到印刷电路板(PCB)上。不同类型的器件焊接到PCB上所采用的方法、步骤及工艺流程有所不同。根据目前国际上公认的习惯分类法,可将SMT组装工艺分为三类:1.
In this paper, the SMT assembly process and welding methods were mainly introduced, and made a summary of the applicable occasions, for circuit design and process personnel reference. Assembly process is the core of surface mount technology (SMT). It focuses on the methods and processes used to solder surface-mount devices (SMDs) to printed circuit boards (PCBs). Different types of devices soldered to the PCB using the methods, procedures and processes are different. According to the current international recognized customary classification, SMT assembly process can be divided into three categories: 1.