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概述了挠性和刚-挠性板的前处理工艺。等离子态去钻污费时和成本高,采用改进的前处理的化学镀铜可以满足挠性印制电路(FPC)大生产的要求。
Overview of the flexible and rigid - flexible board pretreatment process. Plasma-based decontamination is time-consuming and costly, with improved pre-treatment electroless copper plating to meet the requirements of large-scale production of flexible printed circuit (FPC).