无蜡抛光工艺是天律半导体技术研究所研制成功的新工艺.它是用一种含有玻璃纤维、树脂等多种材料特制抛光片,片上根据欲抛光单晶片的直径、厚度的需要,制成凹槽备用.此片能牢固地粘在抛光的金属载体上,在凹槽处轻轻涂上一层纯水,即可把单晶片吸附,进而抛光.原来国内半导体器件研制和生产单位,大都沿用旧工艺,把蜡加热后用以粘单晶片抛光,即使是条件较好的单位有使用无蜡抛光片的,也是用外汇高价从国外引进. Wax-free polishing process is a new technology developed by Tianli Semiconductor Technology Research Institute, which is made of a special polishing material containing various materials, such as glass fiber and resin, and is prepared on the basis of the diameter and the thickness of the wafer to be polished Groove backup. The film can be firmly bonded to the polished metal carrier, the groove gently coated with a layer of pure water, you can single-chip adsorption, and then polished. The original domestic semiconductor device development and production units, mostly Followed by the old process, the wax heated to sticky single-chip polishing, even if the conditions are better units with non-wax polishing films, but also the introduction of foreign exchange at high prices from abroad.