近年来,出现了使用低银钎料的趋势,尤其是Ag-Cu-P 型钎料。Ag15 CuP 钎料就属于这一类。此种钎料含磷量大(4.5～6.5%),在焊铜时会使铜的氧化物很快还原,因而排除了使用钎剂的必要性,但同时会使钎料中生成脆性磷化物,使钎料难于制成丝状(直径1～2 mm)或片状(厚度大于0.2mm)。根据这种情况,捷克斯洛伐克研制了Ag CuP 新材料。下面介绍这项研究成果。 In recent years, there has been a trend toward the use of low silver solder, especially Ag-Cu-P type solder. Ag15 CuP solder belongs to this category. This solder has a large phosphorus content (4.5 to 6.5%) and will rapidly reduce the copper oxide during soldering, thus precluding the need for a flux, but at the same time will result in the formation of brittle phosphides , Making it difficult to make the brazing filler wire (diameter 1 ~ 2 mm) or sheet (thickness greater than 0.2mm). According to this situation, Czechoslovakia developed Ag CuP new material. The following describes the research results.