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研究了Sn-3Ag-0.5Cu(SAC305)/Ni-P与Sn-0.8Ag-0.5Cu-2.0Bi-0.05Ni(SACBN)/Ni-P在403、433、463K温度下时效100、400、700、1 000h的界面IMC变化。结果表明,时效前后SAC305/Ni-P与SACBN/Ni-P的界面IMC都是(Ni,Cu)3Sn4与(Cu,Ni)6Sn5,且(Ni,Cu)3Sn4层在(Cu,Ni)6Sn5与Ni-P层之间。随着时效时间的增加,SAC305/Ni-P与SACBN/Ni-P的界面IMC厚度逐渐增加;随着时效温度的增加,两种钎料的界面IMC厚度也逐渐增加。时效后SACBN/Ni-P焊点界面IMC的生长速率略高于SAC305/Ni-P的界面IMC生长速率,且两种钎料界面IMC生长厚度与时效时间t1/2成线性关系,SAC305/Ni-P和SACBN/Ni-P界面IMC的生长激活能分别是65.18和58.36kJ/mol。
The effects of Sn-3Ag-0.5Cu (SAC305) / Ni-P and Sn-0.8Ag-0.5Cu-2.0Bi-0.05Ni (SACBN) / Ni-P on aging at 100, 400, 700 , 1000h interface IMC changes. The results show that the interface of SAC305 / Ni-P with SACBN / Ni-P is (Ni, Cu) 3Sn4 and (Cu, Ni) 6Sn5 and the (Ni, Cu) And Ni-P layer. With the increase of aging time, the interface IMC thickness of SAC305 / Ni-P and SACBN / Ni-P gradually increased. With the increase of aging temperature, the interface IMC thickness of the two solders also increased gradually. After aging, the growth rate of IMC in the interface of SACBN / Ni-P solder joint was slightly higher than that of SAC305 / Ni-P interface, and the thickness of IMC grew linearly with the aging time t1 / 2. The growth activation energies of IMC at -P and SACBN / Ni-P interface were 65.18 and 58.36 kJ / mol, respectively.