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热、压环境下压阻变换压力传感器的性能可以通过有限元方法预测 .这里研究了简化的 1/ 8模型 ,模型考虑了二氧化硅和氮化硅生成过程及堆阳极键合和胶粘结合过程 .结果发现有限元预测结果和实验数据具有可比性 .范例研究表明 ,硼硅堆导致产生一定的非线性 ,但它隔离了硬环氧树脂的非线性 .在包装过程中最好使用柔性环氧黏合或软黏胶性结合 .黏合材料的黏弹性和黏塑性将会导致传感器输出的滞后和漂移误差 .然而 ,在相对稳定的环境下 ,软黏合剂对传感器的影响可以忽略 .此外 ,详细的设计和过程信息有助于提高模型的适用性
The performance of piezoresistive pressure transducers under thermal and pressure environments can be predicted by the finite element method. Here, a simplified 1/8 model is studied, taking into account the silicon dioxide and silicon nitride formation processes and the anode anodic bonding and adhesive bonding Process.The results show that the finite element prediction and experimental data are comparable.Examples show that the boron-silicon reactor lead to a certain nonlinearity, but it isolated the nonlinearity of the hard epoxy.In the packaging process is best to use a flexible ring Oxygen or Viscoelastic Adhesion The viscoelasticity and viscoplasticity of the bonded material will result in hysteresis and drift errors in the sensor output.However, the effect of the soft adhesive on the sensor is negligible in a relatively stable environment.In addition, the detailed The design and process information helps improve the usability of the model