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第15届电子封装技术国际会议(ICEPT 2014)将于2014年8月12日~15日在中国成都举行。会议由中国电子学会电子制造与封装技术分会(EMPT)主办,由电子科技大学承办。ICEPT系列会议多年来得到了IEEE-CPMT的全力支持和IMAPS、ASME和iNEMI等国际著名行业组织的积极参与,并得到了中国电子学会、中国科协的高度评价,已成为国际电子封装四大品牌会议之一。电子封装技术国际会议为期4天,会议将通过专题讲座、特邀报告、主题论坛、分会报告及论文张贴等形式对电子封装技术的各个领域的最新进展进行交流,感受其无穷的魁力。大会诚邀您
The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) will be held in Chengdu, China from August 12 to 15, 2014. The conference is sponsored by the Electronic Manufacturing and Packaging Technology Branch of China Institute of Electronics (EMPT) and hosted by the University of Electronic Science and Technology of China. Over the years, the ICEPT series of conferences have received the full support of IEEE-CPMT and the active participation of internationally renowned industry organizations such as IMAPS, ASME and iNEMI. They have been highly appraised by China Institute of Electronics and China Association for Science and Technology and have become the four major international electronic packaging brands One of the meetings. The 4-day international conference on electronic packaging technology will bring forth new insights into the latest developments in all areas of electronic packaging technology through lectures, invited reports, theme forums, club reports and essay presentations. The General Assembly invites you